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is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 1 rev. b 10/21 /2014 1mx8 low voltage, ultra low power cmos static ram key features ? high - speed access time: 45ns, 55ns ? cmos low power operation C 36 mw (typical) operating C 12 w (typical) cmos standby ? ttl compatible interface levels ? single power supply C 1.65v - 2.2 v v dd ( 62/65wv10248eall ) C 2.2 v - 3.6v v dd ( 62/65wv10248 ebll) ? data control for upper and lower bytes ? automotive temperature ( - 40 o c to +125 o c) ? lead - free available description the issi is62wv10248eall/ is62wv10248ebll are high - speed, 8m bit static rams organized as 1m words by 8 bits. it is fabricated using issi's high - performance cmos technology. this highly reliable process coupled with innovative circuit design techniques, y ields high - performance and low power consumption devices. when is high (deselected) or when cs2 is low (deselected), the device assumes a standby mode at which the power dissipation can be reduced down with cmos input levels. easy memory expansion is p rovided by using chip enable and output enable inputs. the active low write enable ( ) controls both writing and reading of the memory. the is62wv10248eall and is62wv10248ebll are packaged in the jedec standard 48 - pin mini bga (6mm x 8mm) and 44 - pin tsop (type ii). b lock diagram copyright ? 2014 integrated silicon solution, inc. all rights reserved. issi reserves the right to make changes to this specification and its products at any time without notice. issi assumes no liability arising out of the application or use of any information, products or services described herein. customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. integrated silicon solution, inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. pr oducts are not authorized f or use in such applications unless integrated silicon solution, inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of integrated si licon solution, inc is adequately protected under the circumstances novem ber 2014
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 2 rev. b 10/21 /2014 pin configurations (1m x 8 ) 48 - pin mini bga (b) (6mm x 8mm) 44 - pin tsop (type ii) pin descriptions a0 - a19 address inputs chip enable 1 input cs2 chip enable 2 input output enable input write enable input i/o0 - i/o7 input/output nc no connection v dd power vss ground
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 3 rev. b 10/21 /2014 function description sram is one of random ac cess memories. each byte has an address and can be accessed randomly. sram has three different modes supported. each function is described below with truth table. standby mode device enters standby mode when deselected ( high or c s 2 low ). th e input and output pins (i/o0 - 7 ) ar e p laced in a high impedance state. the current consumption in this mode will be either isb1 or isb2 depending on the input level. cmos input in this mode will maximize saving power. write mode write operati on issues with chip selected ( low a nd cs2 high) and write enable ( ) input low. t he input and output pins(i/o0 - 7 ) are in data input mode. output buffers are c losed during this time even if is low. read mode read operation issues with chip selected ( low and c s 2 high) and write enable ( ) input high. when is low, output buffer turns on to make data output. any input to i/o pins during read mode is not permitted. in the read mode, output buffers can be turned off by pulling high . in this mode, internal device operates as read but i/o s are in a high impedance state. since device is in read mode, active current is used. truth table mode cs2 i/o operation vdd current not selected x h x x high - z isb1, isb2 (power - down) x x l x high - z isb1, isb2 output disabled h l h h high - z icc read h l h l dout icc write l l h x din icc
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 4 rev. b 10/21 /2014 absolute maximum rat ings and operating range absolute maximum rat ings (1) symbol parameter value unit vt er m terminal voltage with respect to gnd C 0.2 to + 3.9 (v dd +0. 3 v) v tbias temperature under bias C 55 to +125 ? c v dd v dd related to gnd C 0.2 to + 3 . 9 (v dd +0. 3 v) v tstg storage temperature C 65 to +150 ? c i out dc output current (low) 20 ma note s: stress greater than those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rat ing conditions for extended period s may affect reliability. operating range (1) range device marking ambient temperature v dd (min) v dd (typ ) v dd (max) commercial is62 wv10248eall 0 ? c to +70 ? c 1.65v 1.8 v 2.2 v industrial is62 wv10248eall - 40 ? c to +85 ? c 1.65v 1.8 v 2.2 v automotive is65 wv10248eall - 40 ? c to +125 ? c 1.65v 1.8 v 2.2 v commercial is62 wv10248ebll 0 ? c to +70 ? c 2.2 v 3. 3 v 3.6 v industrial is62 wv10248ebll - 40 ? c to +85 ? c 2.2 v 3. 3 v 3.6 v automotive is65 wv10248ebll - 40 ? c to +125 ? c 2.2 v 3. 3 v 3.6 v note: 1. full dev ice ac operation assumes a 100 s ramp t ime from 0 to vcc(min) and 200 s wait time after vcc stabilization. pin capacitance (1) parameter symbol test condition max units input capacitance c in t a = 25 c, f = 1 mhz, v dd = v dd (typ) 10 pf dq capacitance (io0 C io7 ) c i/o 10 pf note: 1. these parameters are guaranteed by design and tested by a sample basis only. thermal characterist ics (1) parameter symbol rating units thermal resistance from junction to ambient (airflow = 1m/s) r ja 43.22 c/w thermal resistance from junction to case r jc 13.35 c/w note: 1. t hese parameters are guaranteed by design and tested by a sample basis only.
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 5 rev. b 10/21 /2014 electrical character istics is62 (5) wv10248 eall dc electrical charac teristics - i (over the o perating range ) symbol parameter test conditions min. max. unit v oh output high voltage i oh = - 0.1 ma 1.4 v v ol output low voltage i ol = 0.1 ma 0.2 v v ih ( 1 ) input high voltage 1.4 v dd + 0.2 v v il ( 1 ) input low voltage C 0.2 0.4 v i li input leakage gnd < v in < v dd C 1 1 a i lo output leakage gnd < v in < v dd , o utput disabled C 1 1 a note s: 1. vill(min) = - 1 .0v ac (p ulse width < 10ns ) . not 100% tested. vihh (max ) = vdd + 1 .0v ac (p ulse width < 10ns ) . not 100% tested. is62 (5) wv10248 ebll dc electrical charac teristics - i (over the operating range) symbol parameter test conditions min. max. unit v oh output high voltage 2.2 v dd < 2.7, i oh = - 0.1 ma 2.0 v 2. 7 v dd 3 . 6, i oh = - 1 . 0 ma 2.4 v v ol output low voltage 2.2 v dd < 2.7, i ol = 0.1 ma 0. 4 v 2. 7 v dd 3 . 6, i ol = 2 .1 ma 0. 4 v v ih ( 1 ) input high voltage 2.2 v dd < 2.7 1. 8 v dd + 0. 3 v 2. 7 v dd 3 . 6 2.2 v dd + 0. 3 v v il ( 1 ) input low voltage 2.2 v dd < 2.7 C 0. 3 0. 6 v 2. 7 v dd 3 . 6 C 0. 3 0. 8 v i li input leakage gnd < v in < v dd C 1 1 a i lo output leakage gnd < v in < v dd , o utput disabled C 1 1 a notes: 1. vill(min) = - 2 .0v ac (p ulse width < 10ns ) . not 100% tested. vihh (max) = vdd + 2 .0v ac (p ulse width < 10ns ) . not 100% tested .
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 6 rev. b 10/21 /2014 is62 (5) wv 10248 eall dc electrical charac teristics - ii for power (over the operating range) symbol parameter test conditions grade typ. max. unit icc v dd dynamic operating supply current v dd =v dd (max), i out =0ma, f=f max com. - 12 ma ind. - 15 auto. - 15 icc1 v dd static operating supply current v dd =v dd (max), i out = 0ma, f=0hz com. - 6 ma ind. - 6 auto. - 6 isb1 cmos standby current (cmos inputs) v dd =v dd (max), (1) 0v cs2 0.2v or (2) v dd - 0.2v, cs2 v dd - 0.2v com. - 2 0 a ind. - 25 a auto. - 50 a note : typical values are included for reference only and are not guaranteed or tested. typical values are mea sured at vdd = vdd(typ), ta = 25 ? c is62 (5) wv 10248 ebll dc electrical charac teristics - ii for power (over the operating range) symbol parameter test conditions grade typ. max. unit icc v dd dynamic operating supply current v dd =v dd (max), i out =0ma, f=f max com. - 15 ma ind. - 15 auto. - 15 icc1 v dd static operating supply current v dd =v dd (max), i out = 0ma, f=0hz com. - 6 ma ind. - 6 auto. - 6 isb1 cmos standby current (cmos inputs) v dd =v dd (max), (1) 0v cs2 0.2v or (2) v dd - 0.2v, cs2 v dd - 0.2v com. - 20 a ind. - 25 a auto. - 50 a note : typical values are included for reference only and are not guaranteed or tested. typical values are measured at vdd = vdd(typ ), ta = 25
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 7 rev. b 10/21 /2014 ac test conditions ( over the operating r ange) parameter symbol conditions units input rise time t r 1.0 v/ns input fall time t f 1.0 v/ns output timing reference level v ref ? v tm v output load conditions refer to figure 1 and 2 output load conditio ns figures figure1 figure2 parameters v dd =1.65~1.98v v dd =2.2~2.7v v dd =2.7~3.6v r1 13500 ? 16667? 1103 ? r2 10800 ? 15385? 1554 ? v tm v dd v dd v dd 30pf, including jig and scope r2 r1 v tm output 5pf, including jig and scope r2 r1 v tm output
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 8 rev. b 10/21 /2014 ac characteristics (6) (over operating rang e) read cycle ac charac teristics parameter symbol 4 5ns 55ns unit notes min max min max read cycle time trc 4 5 - 55 - ns 1,5 address access time taa - 4 5 - 55 ns 1 output hold time toha 8 - 8 - ns 1 , cs2 access time tacs1/tacs2 - 4 5 - 55 ns 1 access time tdoe - 2 2 - 25 ns 1 to high - z output thzoe - 18 - 18 ns 2 to low - z output tlzoe 5 - 5 - ns 2 , cs2 to high - z output thzcs/ thzcs2 - 18 - 18 ns 2 , cs2 to low - z output tlzcs /tlzcs2 10 - 10 - ns 2 write cycle ac chara cteristics parameter symbol 4 5ns 55ns unit notes min max min max write cycle time twc 4 5 - 55 - ns 1,3,5 ,cs2 to write end tscs1/tscs2 35 - 40 - ns 1,3 address setup time to write end taw 35 - 40 - ns 1,3 address hold from write end tha 0 - 0 - ns 1,3 address setup time tsa 0 - 0 - ns 1,3 pulse width tpwe 35 - 40 - ns 1,3,4 data setup to write end tsd 28 - 28 - ns 1,3 data hold from write end thd 0 - 0 - ns 1,3 low to high - z output thzw e - 18 - 18 ns 2,3 high to low - z output tlzwe 10 - 10 - ns 2,3 notes: 1. tested with the load in figure 1. 2. tested with the load in figure 2. thzoe, thzcs and thzwe transitions are measured when the output enters a high impedance state. not 100% tested. 3. the internal write time is defined by the ov erlap of =low, cs2=high and =low. all four conditions must be in valid states to initiate a write, but any condition can go inactive to terminate the write. the data input setup and hold timing are referenced to the r ising or falling edge of the signal that terminates the write. 4. tpwe > thzwe + tsd when oe is low. 5. address inputs must meet v ih and v il spec during this period. any glitch or unknown inputs are not permitted. unknown input with standby mode is acceptable. 6. data reten tion characteristics are defined later in data retention characteristics.
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 9 rev. b 10/21 /2014 timing diagram read cycle no. 1 (1,2) (address controlled) ( = =v il , cs2= =v ih ) read cycle no. 2 (1,3) ( , cs2, and controlled) notes: 1. is high for a read cycle. 2. the device is continuously selected. , = vil. cs2= =v ih . 3. address is valid prior to or coincident with low and cs2 high transition. trc address i/o0 - 15 taa toha toha data valid previous data valid low - z low - z
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 10 rev. b 10/21 /2014 write cycle no. 1 ( controlled, = high or low) notes: 1. thzwe is based on the assumption when tsa=0ns after read operation. actual dout for thzwe may not appear if goes high before write cycle. thzoe is the time dout goes to high - z after goes high. 2. during this period the i/os are in output state. do not apply input signals . write cycle no. 2 ( controlled: is high during write cycle) notes: 1. thzwe is based on the assumption when tsa =0ns after read operation. actual dout for thzwe may not appear if goes high before write cycle. thzoe is the time dout goes to high - z after goes high. 2. during this period the i/os are in output state. do not apply input signals
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 11 rev. b 10/21 /2014 write cycle no. 3 ( controlled: is low during write cycle) notes: if is low during write cycle, thzwe must be met in the application. do not apply input signal during this period. data output fr om the previous read operation will drive io bus.
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 12 rev. b 10/21 /2014 data retention characteristics symbol parameter test condition option min. typ. (1 ) max. unit v dr v dd for data retention see data retention waveform is62 (5) wv10248 eall 1. 5 - v is62 (5) wv10248 ebll 1 .5 - v i dr data retention current v dd = v dr (min) , (1) 0v cs2 0.2v, or (2) v dd C 0.2v, cs2 v dd - 0.2v com. - - 2 0 ua ind. - - 25 auto - - 50 t sdr data retention setup time see data retention waveform 0 - - ns t rdr recovery time see data retention waveform trc - - ns note: 1. typical values are measured at v dd =v dr(min) , t a = 25 and not 100% tested. data retention wavef orm ( controlled) data retention wavef orm (cs2 controlled) data retention mode t rdr t sdr v dd gnd v dr > v dd - 0.2v data retention mode t rdr t sdr v dd gnd v dr cs2 cs2 < 0.2v
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 13 rev. b 10/21 /2014 ordering information is62wv10248eall (1.6 5v - 2.2v) industrial range: C 40c to +85c speed (ns) order part no. package 55 is62wv10248eall - 55ti tsop - ii is62wv10248eall - 55tli tsop - ii, lead - free is62wv10248eall - 55bi mini bga is62wv10248eall - 55bli mini bga, lead - free is62wv10248ebll (2.2 v - 3.6v) industrial range: C 40c to +85c speed (ns) order part no. package 45 is62wv10248ebll - 45ti tsop - ii is62wv10248ebll - 45tli tsop - ii, lead - free is62wv10248ebll - 45bi mini bga is62wv10248ebll - 45bli mini bga, lead - free 55 is62wv10248ebll - 55ti tsop - ii is62wv10248ebll - 55tli tsop - ii, lead - free is62wv10248ebll - 55bi mini bga is62wv10248ebll - 55bli mini bga, lead - free is65wv10248ebll (2.2v - 3.6v) automotive range: C 40c to +125c speed (ns) order part no. package 45 is65wv10248ebll - 45ctla3 tsop - ii, lead - free, copper lead - frame
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 14 rev. b 10/21 /2014 package information
is62wv10248eall /bll is65 wv10248eall /bll integrated silicon solution, inc. - www.issi.com 15 rev. b 10/21 /2014 package information

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